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Running head: ESSAY OUTLINE

ESSAY OUTLINE

Essay Outline

Student name

Course:

Instructor:

Strayer University

February 19, 2018

The final essay will be made up of the following sections:

Introduction

Lead-free soldering is increasingly becoming an issue in the electronics assembling industry. The push for lead-free electric industries is fueled by the fact that lead is a well-known toxic substance to the human body. The push for the banning of lead-based solders has increased the demand for the creation of lead-free solder alloys which will replace tin-lead eutectic solders.

Background

Back in 2006, the European Union Waste Electronic Equipment Directive (WEEE) in conjunction with Restriction of Hazardous Substances Directive (RoHS) prohibited the use of significant quantities of lead in majority of the consumer electronics that are produced within European Union (Nur'aishah Aminah Mohd Amin., 2015). Other world governments have also passed legislations that aim to cut down the inclusion of lead in products meant in their territories or regions. So far several bans have been put against lead in paint, lead in gasoline, and lead in plumbing among others.

Material Properties

Lead-free solder alloys have a several properties:

· They have acceptable tolerance for various component elements.

· The melting points of most alloys range between 218-220 0c. This includes alloys such as Sn96.5/Ag3.0/Cu0.5, Sn95.5/Ag3.8/Cu0.7 and Sn95.5/Ag4.0/Cu0.5 (Puttlitz, K. J., & Stalter, 2014).

· They don’t wet as well as other tin-lead solder alloys.

· Electronics industries are shifting towards the tin-silver family of allows for lead-free soldering.

Processing Techniques and Applications

· Lead-free solder alloys are used for high temperature soldering.

· Alloys such as Sn-Ag-Cu are employed in red flow and wave soldering.

· Electrical soldering.

Discussion

Lead-free soldering will be a very instrumental tool that will shape the future of electronics industry. Given the increasing regulatory and health restrictions put against the inclusion of lead in the manufacture of consumer products, it is necessary for produces in this industry to begin their journey towards full employment of lead-free solder alloys in their activities.

References

Puttlitz, K. J., & Stalter, K. A. (2014). Handbook of lead-free solder technology for microelectronic assemblies. CRC Press.

Nur'aishah Aminah Mohd Amin. (2015). The Electrical Properties of Element-added (FE, AL) Lead-free Solder Alloys: Experimental and Materials Modeling Approaches (Doctoral dissertation, Jabatan Kejuruteraan Elektrik, Fakulti Kejuruteraan, Universiti Malaya).