Advance power electric design project
Output Current (A)
E ff
ic ie
n cy
0 5 10 15 20 25 30 35 40 45 80%
82%
84%
86%
88%
90%
92%
94%
D001
Vin = 48 V @ 400 kHz Vin = 48 V @ 600 kHz Vin = 48 V @ 800 kHz Vin = 48 V @ 1 MHz
Q1
Vin C1
LMG5200
Q2
* *
C2
T1
ISO7420 TPS53632
UCC27512
VFB
Q3
Q4
L2
L1
CO RL
SGND
Vout0.8 V ~ 1.2 V / 40 A
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
TI Designs LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
All trademarks are the property of their respective owners.
Description The PMP4497 is a gallium nitride (GaN) based solution for 1.0-V and 40-A core, field programmable array (FPGA), and application specific integrated circuit (ASIC) applications. With high integration and low switching loss, the GaN module LMG5200 enables a high-efficiency, single stage from the 48 to 1.0 V solution to replace the traditional two-stage solution. This design shows the GaN performance and the system advantages compared with the 2-stages solution. A low-cost ER18 planar printed circuit board (PCB) transformer is embedded on the board. The design was achieved in a compact form factor (45 mm × 26 mm × 11 mm). The size could be further reduced by optimizing frequency and components. A design guide with complete test data is provided to facilitate new designs.
Resources
PMP4497 Design Folder LMG5200 Product Folder TPS53632 Product Folder ISO7420FE Product Folder UCC27512DRSR Product Folder TLV70450DBVR Product Folder TLV70433DBVR Product Folder PMP4435 Tools Folder
ASK Our E2E Experts
Features • Input Voltage From 36 to 60 V • Single Stage Half-Bridge and Current Doubler • Peak Efficiency up to 93.7% at 48 V, 1.0 V, and
600 kHz • LMG5200 GaN FET Module • DCAP+ Control With the TPS53632 • 400-kHz to 1-MHz Operation Frequency • I²C Configurable From 0.8 to 1.2 V • Optional Resistor-Configurable Load-Line • Output Over Voltage Protection (OVP), Overcurrent
Protection (OCP), and Output Under Voltage Protection (UVP)
Applications • Servers and High-Performance Computing • Telecom DC-DC Module • Industrial Board Computer, Field Programmable
Gate Array (FPGA), and Application Specific Integrated Circuit (ASIC)
An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other important disclaimers and information.
System Overview www.ti.com
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
1 System Overview
1.1 System Description The PMP4497 implements the 48- to 1-V single-stage power conversion using a hard-switching half- bridge converter with the current-doubler synchronize rectifier. Figure 1 shows the topology implemented in this board. A LMG5200 and EPC2023 GaN FETs are used on the primary side and secondary side respectively. With the GaN MOSFET advantages, such as the zero-reverse recovery, low capacitance, and low Rds-on, the converter could achieve a smaller size and a higher efficiency compared with a traditional two-stage solution (for example, an eighth brick and the 12-V POL module).
Because the half-bridge converter is transformer-based, the converter can be isolated. The TPS53632 controller can support an isolated converter by using a digital isolator, for example, the ISO7420, to drive the primary-side LMG5200. The PMP4497 supports input voltage from 36 to 60 V and output voltage from 0.8 to 1.2 V; the default output voltage is 1.0 V. The output current supports up to 40 A; fan cooling is recommended to help dissipate the heat when operating above 20 A. The output voltage is programmable through an I²C interface. See the TPS53632 data sheet (SLUSBW8) for the details of the I²C program command and the data format.
1.2 Key System Specifications
Table 1. Key System Specifications
PARAMETER TEST CONDITIONS MINIMUM TYP MAXIMUM UNIT INPUT AND OUTPUT CHARACTERISTICS
Input voltage range 36 48 60 V
Input current VIN= 36 V, VOUT= 1.2 V, IOUT= 40 A — — 1.4 A Output voltage I²C programmable 0.8 1.0 1.2 V Output voltage
tolerance IOUT= 0A — — 10 mV
Output current — — — 40 A Over-current
protection — — 60 A
SYSTEM CHARACTERISTICS Switching frequency 400 600 1000 kHz
Peak efficiency VIN= 48 V, VOUT= 1.0 V, IOUT= 15 A, @600kHz withoutcontroller and driver losses — 92.9 — %
Full-load efficiency
VIN= 48 V, VOUT= 1.0 V, IOUT= 40 A, at 600kHz without controller and driver losses — 89.9 — %
Transient load voltage variation
Transient at the 25% full load (10 A), the ELoad slew rate is 2.5 A/µs — ±3 — %
6
4
LMG45200
UVLO
UVLO and Clamp
Level Shifter
5
8
3
1
2
9
7
VCC
HI
LI
HB
VIN
HS
SW
PGND
AGND
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Q1
Vin C1
LMG5200
Q2
* *
C2
T1
ISO7420 TPS53632
UCC27512
VFB
Q3
Q4
L2
L1
CO RL
SGND
Vout0.8 V ~ 1.2 V / 40 A
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
1.3 Block Diagram
Figure 1. PMP4497 Block Diagram
1.4 Highlighted Products
1.4.1 LMG5200 The LMG5200 device integrates an enhancement-mode GaN FET half-bridge power stage with a 100-V driver, which provides a compact solution.
The device extends the advantages of discrete GaN FETs by offering a more user-friendly interface. The device is an ideal solution for the applications requiring high-frequency and high-efficiency operation in a small form factor. Integration reduces the board clearance and creepage needed for a discrete solution while minimizing the loop inductances to ensure fast switching and low ringing.
Figure 2. LMG5200 Functional Block Diagram
ADDR
OSR/USR
USR
OSR
ISUM
DROOP
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
1.4.2 TPS53632 The TPS53632 device is a driverless step-down controller with I²C control. Its advanced features, such as D-CAP+ architecture, provide fast transient response, and high-efficiency operation with minimized output capacitance. The TPS53632 device supports the standard I²C revision 3.0 interface for dynamic control of the output voltage and current monitor telemetry. The device also has dynamic phase adding and shedding control and is able to enter single-phase, discontinuous-current mode operation to maximize light-load efficiency.
Figure 3. TPS53632 Functional Block Diagram
1.4.3 ISO7420 The ISO7420 is a low-power, dual-channel digital isolator. The device is used in the design to deliver isolated control signals from the secondary side to the LMG5200 on the primary side. The ISO7420 provides galvanic isolation up to 2500 V RMS for 1 minute per UL and 4242 VPK per VDE. This device has two isolated channels. Each channel has a logic input and output buffer separated by an insulation barrier. Used in conjunction with an isolated power supply, the device prevents noise current from entering the local ground and interfering with or damaging sensitive circuitry.
1
2
3
4
5
6
VDD
200 N��
230 N��
UVLO
VDD
VDD
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1
2
3
4
8
7
6
5
VCC1
INA
INB
GND1
VCC2
OUTA
OUTB
GND2
Is o
la tio
n
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
Figure 4. ISO7420 Block Diagram
1.4.4 UCC27512 The UCC27512 is a single-channel, high speed, low-side gate-driver device. The device can effectively drive the MOSFET and insulated gate bipolar translator (IGBT) power switches with 4-A peak source and 8-A peak sink asymmetrical drive capability. Using TI intellectual property (IP) that inherently minimizes shoot-through current, the UCC27512 is capable of sourcing and sinking high peak-current pulses into capacitive loads and offering rail-to-rail drive capability with small propagation delay, typically 13 ns. In the PMP4497 design, a duty signal to IN- of the driver to drive the synchronous rectifier MOSFET. IN+ is bypassed by connecting it to VDD directly.
Figure 5. UCC27512 Block Diagram
t0 t1 t2 t3 t4 t5
t
t
t
t
t
Vgs_Q1
Vgs_Q2
t
iL1
iL2
iO
Io/2
VNP_T1
Io/2
Io
+Vin/2
-Vin/2
TSTS/2
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
2 System Design Theory Benefitting from the output ripple current cancellation technique, a half-bridge converter with a current doubler rectifier circuit is suitable for low-profile, high-voltage input and large output current applications and provides higher efficiency. The converter key theoretical waveforms are shown in Figure 6.
Figure 6. Half-Bridge with Current Doubler Timing Diagram
* *
C2
C1
CO RL
T1
Q1
Q2
Q3
Q4
PGND
LMG5200
L1
L2
Vin Vout
t3 ~ t4
SGND
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* *
C2
C1
CO RL
T1
Q1
Q2
Q3
Q4
PGND
LMG5200
L1
L2
Vin Vout
t2 ~ t3
SGND
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* *
C2
C1
CO RL
T1
Q1
Q2
Q3
Q4
PGND
LMG5200
L1
L2
Vin Vout
t1 ~ t2
SGND
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* *
C2
C1
CO RL
T1
Q1
Q2
Q3
Q4
PGND
LMG5200
L1
L2
Vin Vout
t0 ~ t1
SGND
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
2.1 Operation Modes of the Converter With Current Flow The converter in the continuous current mode (CCM) mode has four operation modes during one full switching period as shown in Figure 7.
Figure 7. Operation Modes With Current Flow
O S
in P
V N M D
V 2 N = = ´
´
( )0 S 0 S Vin NS
V D T V 1 D T 2 NP
æ ö ´ - ´ ´ = ´ - ´ç ÷
è ø
( )0 S 1
1
V 1 D T i
L
´ - ´ D =
( )00 V-
Sin 0
P
NV V
2 N
æ ö ´ -ç ÷
è ø
2 0 2
di 0 V L
dt - = ´
1 0 1
di 0 V L
dt - = ´
Sin 2 0 2
P
NV di V L
2 N dt ´ - = ´
1 0 1
di 0 V L
dt - = ´
2 0 2
di 0 V L
dt - = ´
1 0 1
di 0 V L
dt - = ´
2 0 2
di 0 V L
dt - = ´
Sin 1 O 1
P
NV di V L
2 N dt ´ - = ´
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
2.2 Circuit Operation and Description Time interval t0 → t1: During the t0 → t1, Q1 and Q4 are on, and Q2 and Q3 are off. The transformer T1 secondary winding begins to charge the output inductor L1, and the L2 is discharged to the output capacitor and the load.
Time interval t1 →t2: During the t1 → t2, Q1 and Q2 are off, and Q3 and Q4 are on. Both L1 and L2 discharges the current to the output; the inductor current is discharged linearly.
Time interval t2 →t3: During the t2 → t3, Q1 and Q4 are off, and Q2 and Q3 are on. The transformer T1 secondary winding inverses the polarity and begins to charge the output inductor L2, and the current in L1 is discharged to the output capacitor and the load.
Time interval t3 →t4: During the t3 → t4, Q1 and Q2 are off, and Q3 and Q4 are on. Both the L1 and L2 are discharged to the output; the inductor current is decreased linearly.
According to the simplified operation models, during the t0 → t1 (DTs) the winding begins to charge the
inductor L1 with the voltage , and the current i1 increases linearly. Within the t1 → t4 (1-D), the current i1 decreases with the voltage . The inductors ripple current is as follows:
Based on the voltage-second balance of the inductor, the CCM voltage transfer ratio is
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
3 Getting Started Hardware
3.1 Hardware The converter output range is from 0.8 to 1.2 V, and the input voltage range is from 36 to 60 V. Operation should be within the input/output voltage ranges.
If the converter shuts off due to UVP or OCP, the controller IC must be rested to re-enable the converter. To change the output voltage, the I²C bus should be used to set the TPS53632. Consult the user guide for the TPS53632 for the necessary VID protocol (SNVU520). The TPS53632 controller’s switching frequency, voltage ramp rate, load line, and OCP could be changed by modifying resistor values on the board. The TPS53632 data sheet (SLUSCJ3) includes the detailed procedures to choose these components.
3.1.1 Test Equipment • DC voltage source: supplies the EVM from 36 V to 60 V, output current >2A • DC bias source: 6 to approximately 9V or 0.5 A, two outputs for the primary and secondary • Oscilloscope: >200-MHz operation, use oscilloscope probes with a pigtail spring ground clip instead of
the standard alligator clip • DC multimeter: capable of 100-V measurement, suitable for efficiency • DC load: supports 1-V operation at up to 50 A in current-mode operation • Fan cooling: 200-LFM minimum airflow is recommended to cool the PCB when operating over 20-A
output current
3.1.2 Measurement Procedure The following procedure is used to measure the board. 1. Connect the input and output supplies as shown in Figure 8. 2. Connect the oscilloscope to the board to measure input/output voltage. Use a bayonet nut connector
(BNC) to a subminiature version A (SMA) cable or differential probe for the noise immunity. 3. Connect the bias supply. The onboard LDO provides 5 and 3.3 V to the power and control circuitry. 4. Power up the input supply. Operation below 36 V may result in the output voltage range out of
regulation. 5. Power up the bias supply to start the converter. The output voltage will ramp up and the output voltage
should be in regulation. 6. Enable the electronic load and set to a desired load current. 7. Test and measure the input/output voltage response, efficiency, and so forth.
3.1.3 Shutdown Procedure After the measurements have been completed, shut down the board by the following steps: 1. Disable the input voltage supply. 2. Disable the electronic load. 3. Disable the bias supply.
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
4 Testing and Results
4.1 Test Setup
Figure 8. Connection Points
Figure 9. Testing Setup With Full Load
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
Figure 10. Oscilloscope Probe Connections
Input Voltage (V)
P o w
e r
L o ss
( W
)
34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
D003
Output Current (A)
E ff
ic ie
n cy
0 5 10 15 20 25 30 35 40 45 84%
86%
88%
90%
92%
94%
D002
Vin = 36 V Vin = 48 V Vin = 60 V
Output Current (A)
E ff
ic ie
n cy
0 5 10 15 20 25 30 35 40 45 80%
82%
84%
86%
88%
90%
92%
94%
D001
Vin = 48 V @ 400 kHz Vin = 48 V @ 600 kHz Vin = 48 V @ 800 kHz Vin = 48 V @ 1 MHz
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
4.2 Test Data The following sections detail the typical performance curves and waveforms of the PMP4497.
4.2.1 Efficiency Note that most of the efficiency results in this section do not include the controller losses (aside from Figure 14). The default output voltage is 1.0 V.
Figure 11. Efficiency Curve Without Controller Loss Versus Switching Frequency
Figure 12. Efficiency Curve Without Controller Loss Versus Output Current
Figure 13. Power Loss (No Load) Versus Input Voltage
Output Current (A)
E ff
ic ie
n cy
0 5 10 15 20 25 30 35 40 45 80%
82%
84%
86%
88%
90%
92%
94%
D005
Vin = 48 V @ 0.8 V 600 kHz Vin = 48 V @ 1.0 V 600 kHz Vin = 48 V @ 1.2 V 600 kHz
Output Current (A)
E ff
ic ie
n cy
0 5 10 15 20 25 30 35 40 45 78%
80%
82%
84%
86%
88%
90%
92%
D004
Vin = 36 V Vin = 48 V Vin = 60 V
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
Figure 14. Efficiency Curve with Controller Loss Versus Output Current
Figure 15. Efficiency Curve without Controller Loss Versus Vout Change (Through I²C)
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
4.2.2 Transient Load Waveforms
Transient load (0 to 25%) C1: 48-V input voltage 10.0 V/Div C2: 1.0-V output voltage 20.0 mV/Div
Transient load (25 to 50%) C1: 48-V input voltage 10.0 V/Div C2: 1.0-V output voltage 20.0 mV/Div
Transient load (50 to 75%) C1: 48-V input voltage 10.0 V/Div C2: 1.0-V output voltage 20.0 mV/Div
Transient load (75 to 100%) C1: 48-V input voltage 10.0 V/Div C2: 1.0-V output voltage 20.0 mV/Div
Transient load (10 to 90%) C1: 48-V input voltage 10.0 V/Div C2: 1.0-V output voltage 20.0 mV/Div
Transient load (0 to 100%) C1: 48-V input voltage 10.0 V/Div C2: 1.0-V output voltage 20.0 mV/Div
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
4.2.3 Switching Node Waveforms (Full Bandwidth)
Primary Vsw versus PWM1_P no load C1: Vsw switching node 10 V/Div C2: PWM1_P driver signal 2.0 V/Div
Primary Vsw versus PWM1_P full load C1: Vsw switching node 10 V/Div C2: PWM1_P driver signal 2.0 V/Div
Primary Vsw versus PWM1_P full load C1: Vsw switching node 20 V/Div C2: PWM1_P driver signal 5.0 V/Div
Primary Vsw versus PWM1_P full load C1: Vsw switching node 20 V/Div C2: PWM1_P driver signal 5.0 V/Div
Secondary Vds_Q3 versus Vgs_Q3 at 40 A C1: Vds_Q3 5.0 V/Div C2: Vgs_Q3 5.0 V/Div
Secondary Vds_Q3 versus Vgs_Q3 at 40 A C1: Vds_Q3 5.0 V/Div C2: Vgs_Q3 5.0 V/Div
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
4.2.4 IR Scan Thermal Gradient (With Fan Cooling)
Figure 16. 48-V Input at Full Load (1.0 V and 40 A)
LMG5200
VIN Capacitors
Multi-Layer PCB
Small Return Path Minimizes Power Loop
Impedance
xxx xxx
SW
VIN
PGND
Metal 3
PGND
Legend
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
5 Design Files
5.1 Schematics To download the schematics, see the design files at PMP4497.
5.2 Bill of Materials To download the bill of materials (BOM), see the design files at PMP4497.
5.3 PCB Layout Recommendations High-switching speed is important in a high-efficiency design. Optimizing the PCB layout to minimize the power loop impedance and parasitic inductance is a necessary measure to achieve the goal.
It is recommended to use a multilayer board. Power loop parasitic impedance should be minimized by having the input capacitor return path (between VIN and PGND) directly underneath the first layer as shown in the below Figure 17. Loop inductance is reduced due to inductance cancellation as the return current is directly underneath and flowing in the opposite direction. The VCC capacitors and the bootstrap capacitors are placed in the first layer and should be as close to the device as possible.
The AGND of LMG5200 should not be directly connected to PGND in order to avoid the PGND noise and not to cause spurious switching events due to noise coupling to HI and LI signals. Reducing the impedance and the inductances on the board and the PCB layout should comply with the clearance and creepage distance requirements.
Figure 17. Multilayer Board Cross Section With Return Path Directly Underneath for Power Loop
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
Figure 18. LMG5200 Top Layer Placement
5.3.1 Layout Prints To download the layer plots, see the design files at PMP4497.
5.4 Altium Project To download the Altium project files, see the design files at PMP4497.
5.5 Gerber Files To download the Gerber files, see the design files at PMP4497.
5.6 Assembly Drawings To download the assembly drawings, see the design files at PMP4497.
6 Software Files To download the software files, see the design files at PMP4497.
7 References
1. Texas Instruments, Using the LMG5200POLEVM-10A GaN 48V-1V Point-of-Load EVM, User's Guide (SNVU520)
2. Texas Instruments, GaN TECHNOLOGY PREVIEW LMG5200 80-V, GaN Half-Bridge Power Stage, Data Sheet (SNOSCY4)
3. Texas Instruments, Current Doubler Rectifier Offers Ripple Current Cancellation, Application Note (SLUA323)
4. Texas Instruments, Control Driven Synchronous Rectifiers In Phase Shifted Full Bridge Converters, Application Note (SLUA287)
www.ti.com About the Author
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LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
8 About the Author JASON YU is a senior application engineer at Texas Instruments where he is responsible for developing reference design solutions for power systems. Jason brings his extensive experience in high frequency, high density, and digital power design to this role. Jason holds a master's degree in power electronics from South China University of Science and Technology. He has over ten years of experience in power design.
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Revision History
Revision A History NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (September 2016) to A Revision ............................................................................................... Page
• Changed from preview draft ............................................................................................................. 1
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- LMG5200: 48 to 1 V or 40 A Single-Stage Converter Reference Design
- 1 System Overview
- 1.1 System Description
- 1.2 Key System Specifications
- 1.3 Block Diagram
- 1.4 Highlighted Products
- 1.4.1 LMG5200
- 1.4.2 TPS53632
- 1.4.3 ISO7420
- 1.4.4 UCC27512
- 2 System Design Theory
- 2.1 Operation Modes of the Converter With Current Flow
- 2.2 Circuit Operation and Description
- 3 Getting Started Hardware
- 3.1 Hardware
- 3.1.1 Test Equipment
- 3.1.2 Measurement Procedure
- 3.1.3 Shutdown Procedure
- 4 Testing and Results
- 4.1 Test Setup
- 4.2 Test Data
- 4.2.1 Efficiency
- 4.2.2 Transient Load Waveforms
- 4.2.3 Switching Node Waveforms (Full Bandwidth)
- 4.2.4 IR Scan Thermal Gradient (With Fan Cooling)
- 5 Design Files
- 5.1 Schematics
- 5.2 Bill of Materials
- 5.3 PCB Layout Recommendations
- 5.3.1 Layout Prints
- 5.4 Altium Project
- 5.5 Gerber Files
- 5.6 Assembly Drawings
- 6 Software Files
- 7 References
- 8 About the Author
- Revision A History
- Important Notice